JPH0311546B2 - - Google Patents

Info

Publication number
JPH0311546B2
JPH0311546B2 JP1300584A JP1300584A JPH0311546B2 JP H0311546 B2 JPH0311546 B2 JP H0311546B2 JP 1300584 A JP1300584 A JP 1300584A JP 1300584 A JP1300584 A JP 1300584A JP H0311546 B2 JPH0311546 B2 JP H0311546B2
Authority
JP
Japan
Prior art keywords
liquid refrigerant
integrated circuit
nozzle
heat transfer
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1300584A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60160150A (ja
Inventor
Haruhiko Yamamoto
Yukihisa Katsuyama
Mitsuhiko Nakada
Shunichi Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59013005A priority Critical patent/JPS60160150A/ja
Priority to CA000472335A priority patent/CA1227886A/en
Priority to AU37943/85A priority patent/AU552537B2/en
Priority to EP85400098A priority patent/EP0151546B1/en
Priority to DE8585400098T priority patent/DE3586661T2/de
Priority to ES539843A priority patent/ES8602339A1/es
Priority to BR8500360A priority patent/BR8500360A/pt
Priority to KR1019850000461A priority patent/KR900002214B1/ko
Publication of JPS60160150A publication Critical patent/JPS60160150A/ja
Priority to US07/251,978 priority patent/US5050037A/en
Publication of JPH0311546B2 publication Critical patent/JPH0311546B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59013005A 1984-01-26 1984-01-26 集積回路の冷却装置 Granted JPS60160150A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP59013005A JPS60160150A (ja) 1984-01-26 1984-01-26 集積回路の冷却装置
CA000472335A CA1227886A (en) 1984-01-26 1985-01-17 Liquid-cooling module system for electronic circuit components
AU37943/85A AU552537B2 (en) 1984-01-26 1985-01-21 Liquid-cooling module system for electronic components
EP85400098A EP0151546B1 (en) 1984-01-26 1985-01-22 Printed circuit board assembly having a liquid-cooling module system
DE8585400098T DE3586661T2 (de) 1984-01-26 1985-01-22 Bauelemente-anordnung auf einer leiterplatte mit einem modularen, fluessigen kuehlsystem.
ES539843A ES8602339A1 (es) 1984-01-26 1985-01-25 Una disposicion de placa de circuito impreso para componen- tes electronicos
BR8500360A BR8500360A (pt) 1984-01-26 1985-01-25 Conjunto de quadro de circuito impresso
KR1019850000461A KR900002214B1 (ko) 1984-01-26 1985-01-25 인쇄회로기판 조립체
US07/251,978 US5050037A (en) 1984-01-26 1988-09-29 Liquid-cooling module system for electronic circuit components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59013005A JPS60160150A (ja) 1984-01-26 1984-01-26 集積回路の冷却装置

Publications (2)

Publication Number Publication Date
JPS60160150A JPS60160150A (ja) 1985-08-21
JPH0311546B2 true JPH0311546B2 (en]) 1991-02-18

Family

ID=11821058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59013005A Granted JPS60160150A (ja) 1984-01-26 1984-01-26 集積回路の冷却装置

Country Status (1)

Country Link
JP (1) JPS60160150A (en])

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680757B2 (ja) * 1987-11-11 1994-10-12 株式会社日立製作所 半導体モジュール
JP2786193B2 (ja) * 1987-10-26 1998-08-13 株式会社日立製作所 半導体冷却装置
DE3853197T2 (de) * 1987-12-07 1995-06-29 Nippon Electric Co Kühlungssystem für integrierte Schaltungspackung.
CA1303238C (en) * 1988-05-09 1992-06-09 Kazuhiko Umezawa Flat cooling structure of integrated circuit
JP2845447B2 (ja) * 1988-05-09 1999-01-13 日本電気株式会社 集積回路の冷却構造
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
JPH06100408B2 (ja) * 1988-09-09 1994-12-12 日本電気株式会社 冷却装置
DE68925403T2 (de) * 1988-09-20 1996-05-30 Nippon Electric Co Kühlungsstruktur für elektronische Bauelemente
EP0516478A2 (en) * 1991-05-30 1992-12-02 Nec Corporation Cooling structure for integrated circuits
JP2852148B2 (ja) * 1991-10-21 1999-01-27 日本電気株式会社 集積回路パッケージの冷却構造
JP2792304B2 (ja) * 1992-01-22 1998-09-03 日本電気株式会社 集積回路用冷却装置
JP2853481B2 (ja) * 1992-09-30 1999-02-03 日本電気株式会社 半導体素子の冷却構造
CN102423653A (zh) * 2007-09-14 2012-04-25 株式会社爱德万测试 高级热控接口

Also Published As

Publication number Publication date
JPS60160150A (ja) 1985-08-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term